Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper.
Jacopo FrancoH. ArimuraJ.-F. de MarneffeA. VandoorenL.-Å. RagnarssonZhicheng WuDieter ClaesE. Dentoni LittaN. HoriguchiKris CroesDimitri LintenTibor GrasserBen KaczerPublished in: ICICDT (2021)