Efficient Dummy Filling Methods to Reduce Interconnect Capacitance and Number of Dummy Metal Fills.
Atsushi KurokawaToshiki KanamotoTetsuya IbeAkira KasebeWei Fong ChangTetsuro KageYasuaki InoueHiroo MasudaPublished in: IEICE Trans. Fundam. Electron. Commun. Comput. Sci. (2005)