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Chip scale packaging with surface mountable solder ball terminals for microsensors.
Ahra Lee
SangChul Lee
Sungsik Lee
Chang Han Je
Sunghae Jung
Myoung-Lae Lee
Gunn Hwang
Byoung-Gon Yu
Chang Auck Choi
Published in:
NEMS (2009)
Keyphrases
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high speed
high density
mechanical properties
free form
d objects
low cost
printed circuit boards
wire bonding
three dimensional
image structure
surface fitting
solid models
scale space
low power
communication systems
scale invariant
surface reconstruction
object surface
failure rate
vector field
design process