Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries.
Shantonu BiswasMahsa MozafariThomas StaudenHeiko O. JacobsPublished in: Micromachines (2016)
Keyphrases
- mechanical properties
- stainless steel
- three dimensional
- surface discontinuities
- range data
- surface reconstruction
- d objects
- silicon dioxide
- multiple scales
- material properties
- boundary points
- integrated circuit
- computer systems
- high speed
- maximum number
- surface model
- semiconductor manufacturing
- dna computing
- contour lines
- object boundaries