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An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction.
Weishen Chu
Seyyed Ehsan Esfahani Rashidi
Yanli Zhang
Johann Alsmeier
Toshiyuki Sega
Published in:
IMW (2022)
Keyphrases
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analytical model
thin film
analytical models
high density
simulation model
prediction accuracy
short circuit
pattern matching
electron microscopy
grain size
semiconductor manufacturing
solar cell
film thickness
multi layer
plasma etching
integrated circuit
white light interferometry