Yao-Chun Chuang

Publication Activity (10 Years)

Years Active: 2016-2023
Publications (10 Years): 2

Top Topics

Design Principles

Super Resolution

Technical Solutions

Top Venues

Publications

Ryan Lu, Yao-Chun Chuang, Jyun-Lin Wu, Jun He
Reliability Challenges from 2.5D to 3DIC in Advanced Package Development. IRPS (2023)
Tsai-Kan Chien, Lih-Yih Chiou, Yao-Chun Chuang, Shyh-Shyuan Sheu, Heng-Yuan Li, Pei-Hua Wang, Tzu-Kun Ku, Ming-Jinn Tsai, Chih-I Wu
A low store energy and robust ReRAM-based flip-flop for normally off microprocessors. ISCAS (2016)