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Yao-Chun Chuang
Publication Activity (10 Years)
Years Active: 2016-2023
Publications (10 Years): 2
Top Topics
Design Principles
St Century
Super Resolution
Technical Solutions
Top Venues
IRPS
ISCAS
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Publications
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Ryan Lu
,
Yao-Chun Chuang
,
Jyun-Lin Wu
,
Jun He
Reliability Challenges from 2.5D to 3DIC in Advanced Package Development.
IRPS
(2023)
Tsai-Kan Chien
,
Lih-Yih Chiou
,
Yao-Chun Chuang
,
Shyh-Shyuan Sheu
,
Heng-Yuan Li
,
Pei-Hua Wang
,
Tzu-Kun Ku
,
Ming-Jinn Tsai
,
Chih-I Wu
A low store energy and robust ReRAM-based flip-flop for normally off microprocessors.
ISCAS
(2016)