Reliability Challenges from 2.5D to 3DIC in Advanced Package Development.
Ryan LuYao-Chun ChuangJyun-Lin WuJun HePublished in: IRPS (2023)
Keyphrases
- key issues
- technical solutions
- software engineering
- lessons learned
- early days
- open issues
- development process
- design principles
- rapid development
- st century
- application scenarios
- rapid technological
- neural network
- enabling technologies
- computer networking
- design process
- knowledge based systems
- object oriented
- learning environment
- metadata
- machine learning