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Y.-L. Shen
Publication Activity (10 Years)
Years Active: 2002-2016
Publications (10 Years): 1
Top Topics
Low Cost
Internal Structures
Deformable Surface
Top Venues
Microelectron. Reliab.
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Publications
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Y.-L. Shen
,
G. C. Flores
,
J. Guthrie
Numerical study of microbump failure in 3D microelectronic structures.
Microelectron. Reliab.
61 (2016)
Y.-L. Shen
,
R. W. Johnson
Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessment.
Microelectron. Reliab.
53 (1) (2013)
E. J. Cheng
,
Y.-L. Shen
Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging.
Microelectron. Reliab.
52 (3) (2012)
H. X. Xie
,
Nikhilesh Chawla
,
Y.-L. Shen
Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys.
Microelectron. Reliab.
51 (6) (2011)
Y.-L. Shen
,
K. Aluru
Numerical study of ductile failure morphology in solder joints under fast loading conditions.
Microelectron. Reliab.
50 (12) (2010)
W. H. Moy
,
Y.-L. Shen
On the failure path in shear-tested solder joints.
Microelectron. Reliab.
47 (8) (2007)
M. S. Kilijanski
,
Y.-L. Shen
Analysis of thermal stresses in metal interconnects with multilevel structures.
Microelectron. Reliab.
42 (2) (2002)