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E. J. Cheng
Publication Activity (10 Years)
Years Active: 2012-2012
Publications (10 Years): 0
Top Topics
Low Cost
Behavior Patterns
Finite Element Analysis
Thermal Imaging
Top Venues
Microelectron. Reliab.
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Publications
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E. J. Cheng
,
Y.-L. Shen
Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging.
Microelectron. Reliab.
52 (3) (2012)