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Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging.
E. J. Cheng
Y.-L. Shen
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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three dimensional
high density
high speed
thin film
field effect transistors
internal structures
low cost
infrared
human behavior
behavior patterns
d objects
multi view
x ray
thermal imaging
real time
finite element analysis
low power
virtual reality
image registration