Nikhilesh Chawla

Publication Activity (10 Years)

Years Active: 2009-2021
Publications (10 Years): 4

Top Topics

Fusing Multiple

Scanning Electron Microscope

Top Venues

Microelectron. Reliab.

Publications

Sridhar Niverty, Hamid Torbatissaraf, Viktor V. Nikitin, Vincent De Andrade, S. Niauzorau, N. Kublik, B. Azeredo, A. Tekawade, Francesco De Carlo, Nikhilesh Chawla
Computational Imaging in 3D X-Ray Microscopy: Reconstruction, Image Segmentation and Time-Evolved Experiments. ICIP (2021)
Renuka Vallabhaneni, Ehsan Izadi, Carl R. Mayer, C. Shashank Kaira, Sudhanshu S. Singh, Jagannathan Rajagopalan, Nikhilesh Chawla
In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM). Microelectron. Reliab. 79 (2017)
James C. E. Mertens, Antony Kirubanandham, Nikhilesh Chawla
In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens. Microelectron. Reliab. 55 (11) (2015)
Kyle Doudrick, Jeff Chinn, Jason Williams, Nikhilesh Chawla, Konrad Rykaczewski
Rapid method for testing efficacy of nano-engineered coatings for mitigating tin whisker growth. Microelectron. Reliab. 55 (5) (2015)
H. X. Xie, Nikhilesh Chawla
Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints. Microelectron. Reliab. 53 (5) (2013)
Francesco De Carlo, Xianghui Xiao, Kamel Fezzaa, Steve Wang, Nicholas Schwarz, Chris Jacobsen, Nikhilesh Chawla, Florian Fusseis
Data intensive science at synchrotron based 3D x-ray imaging facilities. eScience (2012)
H. X. Xie, Nikhilesh Chawla, Y.-L. Shen
Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys. Microelectron. Reliab. 51 (6) (2011)
S. M. Hayes, Nikhilesh Chawla, D. R. Frear
Interfacial fracture toughness of Pb-free solders. Microelectron. Reliab. 49 (3) (2009)