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Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints.

H. X. XieNikhilesh Chawla
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • electron microscopy
  • x ray
  • mechanical properties
  • thin film
  • data sets
  • database
  • data mining
  • information systems
  • image processing
  • similarity measure
  • preprocessing
  • natural language processing
  • mechanical design