Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessment.

Y.-L. Shen R. W. Johnson

Published in: Microelectron. Reliab. (2013)

Keyphrases

high speed
analog vlsi
low cost
multi class
single chip
high density
strain energy
combining multiple
parametric models
low power
sensitivity analysis
deformable objects
circuit design
medical images
physical design
power dissipation
deformable surface
image processing
data sets