William Koven

Publication Activity (10 Years)

Years Active: 2013-2024
Publications (10 Years): 5

Top Topics

Asynchronous Communication

Industry Standard

Deformable Template

Top Venues

Publications

Tony F. Wu, Huichu Liu, Huseyin Ekin Sumbul, Lita Yang, Dipti Baheti, Jeremy Coriell, William Koven, Anu Krishnan, Mohit Mittal, Matheus Trevisan Moreira, Max Waugaman, Laurent Ye, Edith Beigné
11.2 A 3D integrated Prototype System-on-Chip for Augmented Reality Applications Using Face-to-Face Wafer Bonded 7nm Logic at <2μm Pitch with up to 40% Energy Reduction at Iso-Area Footprint. ISSCC (2024)
Matheus Trevisan Moreira, William Koven, Tony F. Wu, H. Ekin Sumbul, Edith Beigné
A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell Libraries. ASYNC (2023)
H. Ekin Sumbul, Tony F. Wu, Yuecheng Li, Syed Shakib Sarwar, William Koven, Eli Murphy-Trotzky, Xingxing Cai, Elnaz Ansari, Daniel H. Morris, Huichu Liu, Doyun Kim, Edith Beigné
System-Level Design and Integration of a Prototype AR/VR Hardware Featuring a Custom Low-Power DNN Accelerator Chip in 7nm Technology for Codec Avatars. CICC (2022)
Maxwell Waugaman, William Koven
Sharp - A Resilient Asynchronous Template. ASYNC (2017)
Dylan Hand, Austin Katrin, William Koven
Adding Conditionality to Resilient Bundled-Data Designs. ASYNC (2016)
Arash Saifhashemi, Dylan Hand, Peter A. Beerel, William Koven, Hong Wang
Performance and Area Optimization of a Bundled-Data Intel Processor through Resynthesis. ASYNC (2014)
Tynan McAuley, William Koven, Andrew Carter, Paula Ning, David Money Harris
Implementation of a 64-bit Jackson adder. ACSSC (2013)
Andrew Carter, Paula Ning, William Koven, David Money Harris, Michael Braly, Nathan Jones, Julien Massas, Trevin Murakami, Alexandra Simoni, Sanu Mathew
Comparison of parallelized radix-2 and radix-4 scalable Montgomery multipliers. ACSSC (2013)