Thorben Casper

Publication Activity (10 Years)

Years Active: 2016-2020
Publications (10 Years): 11

Top Topics

Simulation Model

Top Venues

Comput. Math. Appl.

Publications

Thorben Casper, Ulrich Römer, Herbert De Gersem, Sebastian Schöps
Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging. Comput. Math. Appl. 79 (6) (2020)
Katrin Hirmer, Thorben Casper, Sebastian Schöps, Klaus Hofmann
3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements. CoRR (2019)
Thorben Casper, Ulrich Römer, Sebastian Schöps, Herbert De Gersem
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging. CoRR (2018)
Thorben Casper, David Duque, Sebastian Schöps, Herbert De Gersem
Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems. CoRR (2018)
Steve Bigalke, Jens Lienig, Thorben Casper, Sebastian Schöps
Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization. PRIME (2018)
Alexander Krimm, Thorben Casper, Sebastian Schöps, Herbert De Gersem, Ludovic Chamoin
Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique. CoRR (2018)
Dimitrios Loukrezis, Ulrich Römer, Thorben Casper, Sebastian Schöps, Herbert De Gersem
High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition. CoRR (2016)
Thorben Casper, Herbert De Gersem, Sebastian Schöps
Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models. CoRR (2016)
Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps
Electrothermal Simulation of Bonding Wire Degradation under Uncertain Geometries. CoRR (2016)
Thorben Casper, Ulrich Römer, Sebastian Schöps
Determination of Bond Wire Failure Probabilities in Microelectronic Packages. CoRR (2016)
Thorben Casper, Herbert De Gersem, Renaud Gillon, Tomás Gotthans, Tomas Kratochvil, Peter Meuris, Sebastian Schöps
Electrothermal simulation of bonding wire degradation under uncertain geometries. DATE (2016)