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Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging.
Thorben Casper
Ulrich Römer
Herbert De Gersem
Sebastian Schöps
Published in:
Comput. Math. Appl. (2020)
Keyphrases
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high density
power supply
high speed
heat flow
mathematical model
wire bonding
supply chain
model selection
high order
thin film
modular design