Determination of Bond Wire Failure Probabilities in Microelectronic Packages.

Thorben Casper Ulrich Römer Sebastian Schöps

Published in: CoRR (2016)

Keyphrases

bond pad
stress response
wire bonding
probability distribution
root cause
thin film
failure rate
failure prediction
probability estimates
success or failure
failure detection
bayes theorem
multi agent
database
highly reliable
belief networks
failure modes
joint probability
case study
search engine
machine learning