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Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging.
Thorben Casper
Ulrich Römer
Sebastian Schöps
Herbert De Gersem
Published in:
CoRR (2018)
Keyphrases
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high speed
high density
low cost
application specific
neural network
multiresolution
mathematical model
steady state
image analysis
thin film
power supply
heat flow