Rohit Dhiman

Publication Activity (10 Years)

Years Active: 2011-2023
Publications (10 Years): 10

Top Topics

Integrated Circuit

Frequency Response

Data Envelopment Analysis

Top Venues

Microelectron. J.

Publications

Ajay Kumar, Rohit Dhiman
Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs. Microelectron. J. 141 (2023)
Ajay Kumar, Rohit Dhiman
Differential Multi-bit Through Glass Vias for Three-Dimensional Integrated Circuits. VDAT (2022)
Ajay Kumar, Rajeevan Chandel, Rohit Dhiman
Proposal and analysis of carbon nanotube based differential multibit through glass vias. Microelectron. J. 126 (2022)
Anchal Thakur, Rohit Dhiman
source/drain NT JLFET for enhanced hot carrier reliability with temperature measurement. Microelectron. J. 126 (2022)
Ashish Singh, Rajeevan Chandel, Rohit Dhiman
Proposal and analysis of relative stability in mixed CNT bundle for sub-threshold interconnects. Integr. 80 (2021)
Palak Sood, Rohit Dhiman
Brain-Computer Interfacing: Design of Virtual Keyboard. ICCCNT (2021)
Anchal Thakur, Rohit Dhiman
Design and Performance Analysis of SiGe Hetero Nanotube Junctionless FET. TENCON (2019)
Manish Joshi, Koduri Teja, Ashish Singh, Rohit Dhiman
Delay and Frequency Investigations in Coupled MLGNR Interconnects. VDAT (2017)
Ramesh Kumar, Rohit Dhiman, Rajeevan Chandel
Performance Analysis of Top-Contact MLGNR Based Interconnects. iNIS (2016)
Abhishek Shrivastava, Ajay Pratap Gangwar, Rahul Kumar, Rohit Dhiman
A 60 dB Bulk-Driven Rail-to-Rail Input/Output OTA. iNIS (2016)
Rohit Dhiman, Rajeevan Chandel
Dynamic Crosstalk Analysis in Coupled Interconnects for Ultra-Low Power Applications. Circuits Syst. Signal Process. 34 (1) (2015)
Rohit Dhiman, Rajeevan Chandel
Sub-Threshold Delay and Power Analysis of Complementary Metal-Oxide Semiconductor Buffer Driven Interconnect Load for Ultra Low Power Applications. J. Low Power Electron. 8 (1) (2012)
T. Alam, Rohit Dhiman, Rajeevan Chandel
Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect. ICWET (2011)