Pak-kin Mak

Publication Activity (10 Years)

Years Active: 1997-2018
Publications (10 Years): 3

Top Topics

Memory Subsystem

Ibm Zenterprise

Physical Design

Floating Point Unit

Top Venues

IBM J. Res. Dev.

IEEE J. Solid State Circuits

Publications

Christian Jacobi, Anthony Saporito, Martin Recktenwald, Aaron Tsai, Ulrich Mayer, Markus M. Helms, Adam Collura, Pak-kin Mak, Robert J. Sonnelitter, Michael A. Blake, Tim Bronson, Arthur O'neill, Vesselina K. Papazova
Design of the IBM z14 microprocessor. IBM J. Res. Dev. 62 (2/3) (2018)
James D. Warnock, Brian W. Curran, John Badar, Gregory Fredeman, Donald W. Plass, Yuen H. Chan, Sean M. Carey, Gerard Salem, Friedrich Schroeder, Frank Malgioglio, Guenter Mayer, Christopher J. Berry, Michael H. Wood, Yiu-Hing Chan, Mark D. Mayo, John Isakson, Charudhattan Nagarajan, Tobias Werner, Leon J. Sigal, Ricardo Nigaglioni, Mark Cichanowski, Jeffrey A. Zitz, Matthew M. Ziegler, Tim Bronson, Gerald Strevig, Daniel Dreps, Ruchir Puri, Douglas Malone, Dieter F. Wendel, Pak-kin Mak, Michael A. Blake
4.1 22nm Next-generation IBM System z microprocessor. ISSCC (2015)
Craig R. Walters, Pak-kin Mak, D. P. D. Berger, Michael A. Blake, Tim Bronson, K. D. Klapproth, A. J. O'Neill, Robert J. Sonnelitter, Vesselina K. Papazova
The IBM z13 processor cache subsystem. IBM J. Res. Dev. 59 (4/5) (2015)
James D. Warnock, Yuen H. Chan, Hubert Harrer, Sean M. Carey, Gerard Salem, Doug Malone, Ruchir Puri, Jeffrey A. Zitz, Adam Jatkowski, Gerald Strevig, Ayan Datta, Anne Gattiker, Aditya Bansal, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, David L. Rude, Leon J. Sigal, Thomas Strach, Howard H. Smith, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb
Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module. IEEE J. Solid State Circuits 49 (1) (2014)
James D. Warnock, Yuen H. Chan, Hubert Harrer, David L. Rude, Ruchir Puri, Sean M. Carey, Gerard Salem, Guenter Mayer, Yiu-Hing Chan, Mark D. Mayo, Adam Jatkowski, Gerald Strevig, Leon J. Sigal, Ayan Datta, Anne Gattiker, Aditya Bansal, Doug Malone, Thomas Strach, Huajun Wen, Pak-kin Mak, Chung-Lung Kevin Shum, Donald W. Plass, Charles F. Webb
5.5GHz system z microprocessor and multi-chip module. ISSCC (2013)
Fadi Busaba, Michael A. Blake, Brian W. Curran, Michael F. Fee, Christian Jacobi, Pak-kin Mak, Brian R. Prasky, Craig R. Walters
IBM zEnterprise 196 microprocessor and cache subsystem. IBM J. Res. Dev. 56 (1) (2012)
Brian W. Curran, Lee Eisen, Eric M. Schwarz, Pak-kin Mak, James D. Warnock, Patrick J. Meaney, Michael F. Fee
The zEnterprise 196 System and Microprocessor. IEEE Micro 31 (2) (2011)
James D. Warnock, Y. Chan, William V. Huott, Sean M. Carey, Michael F. Fee, Huajun Wen, M. J. Saccamango, Frank Malgioglio, Patrick J. Meaney, Donald W. Plass, Yuen H. Chan, Mark D. Mayo, Guenter Mayer, Leon J. Sigal, David L. Rude, Robert M. Averill III, Michael H. Wood, Thomas Strach, Howard H. Smith, Brian W. Curran, Eric M. Schwarz, Lee Eisen, Doug Malone, Steve Weitzel, Pak-kin Mak, Thomas J. McPherson, Charles F. Webb
A 5.2GHz microprocessor chip for the IBM zEnterprise™ system. ISSCC (2011)
Pak-kin Mak, Craig R. Walters, Gary E. Strait
IBM System z10 processor cache subsystem microarchitecture. IBM J. Res. Dev. 53 (1) (2009)
Pak-kin Mak, Gary E. Strait, Michael A. Blake, Kevin W. Kark, Vesselina K. Papazova, A. E. (Rick) Seigler, Gary A. Van Huben, Liyong Wang, George C. Wellwood
Processor subsystem interconnect architecture for a large symmetric multiprocessing system. IBM J. Res. Dev. 48 (3-4) (2004)
Paul R. Turgeon, Pak-kin Mak, Michael A. Blake, Michael F. Fee, Carl B. Ford III, Patrick J. Meaney, A. E. (Rick) Seigler, William Wu Shen
The S/390 G5/G6 binodal cache. IBM J. Res. Dev. 43 (5) (1999)
Pak-kin Mak, Michael A. Blake, Christine C. Jones, Gary E. Strait, Paul R. Turgeon
Shared-cache clusters in a system with a fully shared memory. IBM J. Res. Dev. 41 (4&5) (1997)