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K. N. Chiang
ORCID
Publication Activity (10 Years)
Years Active: 2006-2016
Publications (10 Years): 1
Top Topics
Reliability Assessment
Printed Circuit Boards
Numerical Methods
Failure Rate
Top Venues
Microelectron. Reliab.
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Publications
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K.-C. Wu
,
K. N. Chiang
Characterization on acceleration-factor equation for packaging-solder joint reliability.
Microelectron. Reliab.
65 (2016)
T. Y. Hung
,
S. Y. Chiang
,
C. J. Huang
,
C. C. Lee
,
K. N. Chiang
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test.
Microelectron. Reliab.
51 (9-11) (2011)
C. C. Chiu
,
H. H. Chang
,
C. C. Lee
,
C. C. Hsia
,
K. N. Chiang
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure.
Microelectron. Reliab.
47 (9-11) (2007)
Ming-Chih Yew
,
C. Y. Chou
,
C. S. Huang
,
W. K. Yang
,
K. N. Chiang
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis.
Microelectron. Reliab.
46 (9-11) (2006)