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S. Y. Chiang
Publication Activity (10 Years)
Years Active: 2011-2011
Publications (10 Years): 0
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Publications
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T. Y. Hung
,
S. Y. Chiang
,
C. J. Huang
,
C. C. Lee
,
K. N. Chiang
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test.
Microelectron. Reliab.
51 (9-11) (2011)