Login / Signup
K.-C. Wu
Publication Activity (10 Years)
Years Active: 2016-2016
Publications (10 Years): 1
Top Topics
Reliability Assessment
Printed Circuit Boards
Numerical Methods
Failure Rate
Top Venues
Microelectron. Reliab.
</>
Publications
</>
K.-C. Wu
,
K. N. Chiang
Characterization on acceleration-factor equation for packaging-solder joint reliability.
Microelectron. Reliab.
65 (2016)