Jürgen Wilde

Publication Activity (10 Years)

Years Active: 2001-2016
Publications (10 Years): 1

Top Topics

Autonomous Agents

Reliability Assessment

Mechanical Design

Top Venues

Microelectron. Reliab.

Publications

Adeel Ahmad Bajwa, Jürgen Wilde
Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices. Microelectron. Reliab. 60 (2016)
Matthias Steiert, Jürgen Wilde
Influence of dicing damages on the thermo-mechanical reliability of bare-chip assemblies. Microelectron. Reliab. 54 (9-10) (2014)
Sabrina Rathgeber, R. Bauer, Andreas Otto, Erik Peter, Jürgen Wilde
Harsh environment application of electronics - Reliability of copper wiring and testability thereof. Microelectron. Reliab. 52 (9-10) (2012)
Stefan Martens, B. Krueger, Walter Mack, Friedemann Voelklein, Jürgen Wilde
Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting. Microelectron. Reliab. 48 (8-9) (2008)
Jürgen Wilde, Yuqing Lai
Design optimization of an eddy current sensor using the finite-elements method. Microelectron. Reliab. 43 (3) (2003)
M. Thoben, X. Xie, D. Silber, Jürgen Wilde
Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size. Microelectron. Reliab. 41 (9-10) (2001)