Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size.
M. ThobenX. XieD. SilberJürgen WildePublished in: Microelectron. Reliab. (2001)
Keyphrases
- ibm power processor
- high speed
- low cost
- chip design
- high density
- power dissipation
- analog vlsi
- modular design
- physical design
- power consumption
- multithreading
- vlsi implementation
- programmable logic
- vlsi design
- functional verification
- database
- input output
- solid models
- single chip
- building blocks
- genetic algorithm
- memory subsystem
- data sets