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Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting.
Stefan Martens
B. Krueger
Walter Mack
Friedemann Voelklein
Jürgen Wilde
Published in:
Microelectron. Reliab. (2008)
Keyphrases
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low cost
high accuracy
preprocessing
segmentation method
synthetic data
surface registration
high precision
dynamic programming
objective function
support vector machine
probabilistic model
segmentation algorithm
clustering method
detection method
prior knowledge
computational complexity
three dimensional