Erping Li

Publication Activity (10 Years)

Years Active: 2003-2024
Publications (10 Years): 3

Top Topics

Gallium Arsenide

Artificial Neural Network Models

Logistic Regression

Top Venues

Microelectron. J.

Publications

Tiancheng Li, Erping Li, Huali Duan, Zhufei Chu, Jian Wang, Wenchao Chen
Artificial neural network models for metal-ferroelectric-insulator-semiconductor ferroelectric tunnel junction memristor. Microelectron. J. 144 (2024)
Huali Duan, Erping Li, Qinyi Huang, Yuehang Xu, Wenchao Chen
Multiphysics simulation study of thermal stress effects in nanoscale FinFETs heterogeneously integrated with GaN high-power device on silicon substrate. Microelectron. J. 150 (2024)
Tianning Zhang, Yee Sin Ang, Erping Li, Chun Yun Kee, L. K. Ang
SUTD-PRCM Dataset and Neural Architecture Search Approach for Complex Metasurface Design. CoRR (2022)
Oka Kurniawan, Man-Fai Ng, Wee Shing Koh, Zuan Yi Leong, Erping Li
Simplified model for ballistic current-voltage characteristic in cylindrical nanowires. Microelectron. J. 41 (2-3) (2010)
Xiaomeng Shi, Kiat Seng Yeo, Jianguo Ma, Manh Anh Do, Erping Li
Complex Shaped On-Wafer Interconnects Modeling for CMOS RFICs. IEEE Trans. Very Large Scale Integr. Syst. 16 (7) (2008)
Xiaomeng Shi, Jianguo Ma, Kiat Seng Yeo, Manh Anh Do, Erping Li
Equivalent circuit model of on-wafer CMOS interconnects for RFICs. IEEE Trans. Very Large Scale Integr. Syst. 13 (9) (2005)
Hongfan Jin, Erping Li, Weiliang Yuan, Lewei Li
Parallel FDTD computing for emc simulation in high-speed electronics. Int. J. Comput. Eng. Sci. 5 (3) (2004)
Beng Hwee Ong, Choon Beng Sia, Kiat Seng Yeo, Jianguo Ma, Manh Anh Do, Erping Li
Investigating the frequency dependence elements of CMOS RFIC interconnects for physical modeling. SLIP (2004)
Yaojiang Zhang, Fang Wu, Erping Li
Parallel fast multipole method for large-scale computation of electromagnetic scattering. Int. J. Comput. Eng. Sci. 5 (2) (2004)
Enfeng Liu, Ruqi Han, Erping Li, Ping Bai
A novel hydrodynamic model for nanoscale devices simulation. Microelectron. J. 34 (4) (2003)