Chun K. Lim

Publication Activity (10 Years)

Years Active: 1993-1993
Publications (10 Years): 0

Publications

Chun K. Lim, Thomas Caulfield, Joseph Benenati
Preface. IBM J. Res. Dev. 37 (5) (1993)
Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim
Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. IBM J. Res. Dev. 37 (5) (1993)
Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik
Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM J. Res. Dev. 37 (5) (1993)