William T. Chen

Publication Activity (10 Years)

Years Active: 1964-1993
Publications (10 Years): 0

Publications

Tien Y. Wu, Yifan Guo, William T. Chen
Thermal-mechanical strain characterization for printed wiring boards. IBM J. Res. Dev. 37 (5) (1993)
Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik
Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM J. Res. Dev. 37 (5) (1993)
William T. Chen
Displacement Discontinuity over a Transversely Isotropic Elastic Half-Space. IBM J. Res. Dev. 8 (4) (1964)