Thermal-mechanical strain characterization for printed wiring boards.
Tien Y. WuYifan GuoWilliam T. ChenPublished in: IBM J. Res. Dev. (1993)
Keyphrases
- solder ball connect
- finite element analysis
- finite element model
- infrared
- electrical power
- building blocks
- integrated circuit
- data mining
- experimental data
- real time
- mechanical design
- learning algorithm
- information retrieval
- database
- optical character recognition
- power plant
- high temperature
- music scores
- injection lasers