Charles G. Woychik

Publication Activity (10 Years)

Years Active: 1993-1993
Publications (10 Years): 0

Publications

Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik
Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. IBM J. Res. Dev. 37 (5) (1993)