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Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation.
Yifan Guo
Chun K. Lim
William T. Chen
Charles G. Woychik
Published in:
IBM J. Res. Dev. (1993)
Keyphrases
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solder ball connect
infrared
image registration
high level
image interpretation
container terminal
loading conditions
learning algorithm
least squares
power system
image reconstruction
deformable objects
deformable surface
measurement error