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Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations.
Hyung-Chu Choi
Yifan Guo
William LaFontaine
Chun K. Lim
Published in:
IBM J. Res. Dev. (1993)
Keyphrases
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solder ball connect
image processing
image analysis
statistical analysis
infrared
finite element analysis
image enhancement
digital image processing
databases
data mining
information retrieval
face recognition
multiscale
image registration
image restoration
quantitative analysis