William LaFontaine

Publication Activity (10 Years)

Years Active: 1993-1993
Publications (10 Years): 0

Publications

Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim
Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. IBM J. Res. Dev. 37 (5) (1993)