Anmin Hu

Publication Activity (10 Years)

Years Active: 1998-2022
Publications (10 Years): 2

Top Topics

Transfer Learning

Electron Microscopy

Urban Environments

Top Venues

Microelectron. Reliab.

Publications

Gaode Chen, Yijun Su, Xinghua Zhang, Anmin Hu, Guochun Chen, Siyuan Feng, Ji Xiang, Junbo Zhang, Yu Zheng
A Cross-City Federated Transfer Learning Framework: A Case Study on Urban Region Profiling. CoRR (2022)
Anmin Hu, Lijun Zhang
Adaptive Indoor Localization with Wi-Fi Based on Transfer Learning. ICCE-TW (2019)
Jiaxing Liang, Tingbi Luo, Anmin Hu, Ming Li
Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates. Microelectron. Reliab. 54 (1) (2014)
Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li
Study on low-Ag content Sn-Ag-Zn/Cu solder joints. Microelectron. Reliab. 53 (12) (2013)
Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. Microelectron. Reliab. 53 (2) (2013)
Wenjing Zhang, Wei Luo, Anmin Hu, Ming Li
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation. Microelectron. Reliab. 52 (6) (2012)
Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao
Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder. Microelectron. Reliab. 52 (3) (2012)
Wenyan Gen, Xi Chen, Anmin Hu, Ming Li
Effect of Ag on oxidation of Cu-base leadframe. Microelectron. Reliab. 51 (4) (2011)
Jinglin Bi, Anmin Hu, Jing Hu, Tingbi Luo, Ming Li, Dali Mao
Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates. Microelectron. Reliab. 51 (3) (2011)
Brian D. Corner, Anmin Hu
Effect of Sway on Image Fidelity in Whole-body Digitizing. Three-Dimensional Image Capture and Applications (1998)