Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation.
Wenjing ZhangWei LuoAnmin HuMing LiPublished in: Microelectron. Reliab. (2012)
Keyphrases
- hierarchical structure
- hierarchical structures
- hierarchically structured
- hierarchical classification
- hierarchical organization
- binary tree
- tree structure
- image representation
- formal concept analysis
- hierarchical data structures
- multiscale
- multi dimensional
- user interface
- mechanical properties
- random effects
- data model
- electron microscopy
- feature selection
- neural network