Login / Signup
Dali Mao
Publication Activity (10 Years)
Years Active: 2011-2014
Publications (10 Years): 0
Top Topics
Wire Bonding
Mechanical Properties
Computer Vision
Visual Interface
Top Venues
Microelectron. Reliab.
</>
Publications
</>
Rui Guo
,
Liming Gao
,
Dali Mao
,
Ming Li
,
Xu Wang
,
Zhong Lv
,
Hope Chiu
Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding.
Microelectron. Reliab.
54 (11) (2014)
Tingbi Luo
,
Anmin Hu
,
Jing Hu
,
Ming Li
,
Dali Mao
Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder.
Microelectron. Reliab.
52 (3) (2012)
Mingzhi Ni
,
Ming Li
,
Dali Mao
Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers.
Microelectron. Reliab.
52 (1) (2012)
Jinglin Bi
,
Anmin Hu
,
Jing Hu
,
Tingbi Luo
,
Ming Li
,
Dali Mao
Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates.
Microelectron. Reliab.
51 (3) (2011)