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Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core.

Wei FengNaoya WatanabeHaruo ShimamotoMasahiro AoyagiKatsuya Kikuchi
Published in: 3DIC (2019)
Keyphrases
  • mechanical properties
  • high temperature
  • composite materials
  • infrared
  • multiresolution
  • data sets
  • neural network
  • search engine
  • probabilistic model
  • experimental data
  • numerical simulations