Interconnect and Thermal-aware Floorplanning for 3D Microprocessors.

Wei-Lun Hung Greg M. Link Yuan Xie Narayanan Vijaykrishnan Mary Jane Irwin

Published in: ISQED (2006)

Keyphrases

high speed
infrared
computer architecture
computing power
personal computer
neural network
solder ball connect
air temperature
thermal images
instruction set
power dissipation
mobile robot
multiscale
bayesian networks
knowledge base
search engine
genetic algorithm
machine learning