Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications.
Paul D. FranzonJohn M. WilsonMing LiPublished in: 3DIC (2010)
Keyphrases
- low cost
- infrared
- high speed
- analog vlsi
- physical design
- inductive learning
- communication systems
- high density
- ultra high
- single chip
- machine learning
- knowledge representation
- vlsi design
- vlsi implementation
- host computer
- functional programs
- finite element analysis
- power plant
- communication networks
- communication channels
- evolvable hardware
- room temperature
- programmable logic
- concept learning
- operating system
- real time