Transient Simulations of Three-Dimensional Integrated Circuit Interconnect Using a Mixed Surface-Volume Approach.
Mike ChouTom KorsmeyerJacob WhitePublished in: DAC (1995)
Keyphrases
- integrated circuit
- three dimensional
- surface reconstruction
- surface model
- d objects
- laser scanning
- physical models
- multi view
- electron beam
- surface representation
- steady state
- d mesh
- x ray
- high speed
- human body
- volumetric images
- real time
- electron microscope
- efficient implementation
- range data
- range images
- image sequences