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Power-safe application of tdf patterns to flip-chip designs during wafer test.

Wei ZhaoJunxia MaMohammad TehranipoorSreejit Chakravarty
Published in: ACM Trans. Design Autom. Electr. Syst. (2013)
Keyphrases
  • high speed
  • low cost
  • pattern mining
  • real time
  • statistical tests
  • modular design