Login / Signup
A Neural Network Approach to the Inspection of Ball Grid Array Solder Joints on Printed Circuit Boards.
Kuk Won Ko
Young Jun Roh
Hyung Suck Cho
Hyung Cheol Kim
Published in:
IJCNN (5) (2000)
Keyphrases
</>
printed circuit boards
neural network
visual inspection
integrated circuit
artificial neural networks
neural network model
manufacturing process
grid computing
pattern recognition
information systems
e learning
fuzzy logic
back propagation
computer vision
surface defects