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Effects of bonding force on contact pressure and frictional energy in wire bonding.

Yong DingJang-Kyo KimPin Tong
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • wire bonding
  • force feedback
  • energy consumption
  • failure modes
  • real time
  • contact force
  • stress response
  • rigid body
  • force field
  • control system
  • sensor networks
  • haptic device