Jang-Kyo Kim

Publication Activity (10 Years)

Years Active: 2006-2008
Publications (10 Years): 0

Publications

Yong Ding, Jang-Kyo Kim
Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise. Microelectron. Reliab. 48 (1) (2008)
Yong Ding, Jang-Kyo Kim, Pin Tong
Effects of bonding force on contact pressure and frictional energy in wire bonding. Microelectron. Reliab. 46 (7) (2006)