Numerical analysis of ultrasonic wire bonding: Part 2. Effects of bonding parameters on temperature rise.

Yong Ding Jang-Kyo Kim

Published in: Microelectron. Reliab. (2008)

Keyphrases

numerical analysis
image enhancement
wire bonding
sensitivity analysis
measured data
parameter values
parameter settings
expectation maximization
parameter estimation
nonlinear dynamics
least squares