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Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards.
L. Hua
H. N. Hou
Published in:
Microelectron. Reliab. (2017)
Keyphrases
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printed circuit boards
mass transfer
visual inspection
integrated circuit
business intelligence
mechanical properties
real time
expert systems
user interface
manufacturing process
image analysis
knowledge based systems
surface defects