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L. Hua
Publication Activity (10 Years)
Years Active: 2011-2017
Publications (10 Years): 1
Top Topics
Printed Circuit Boards
Mechanical Properties
Surface Defects
Top Venues
Microelectron. Reliab.
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Publications
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L. Hua
,
H. N. Hou
Electrochemical corrosion and electrochemical migration of 64Sn-35Bi-1Ag solder doping with xGe on printed circuit boards.
Microelectron. Reliab.
75 (2017)
L. Hua
,
C. Yang
Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution.
Microelectron. Reliab.
51 (12) (2011)