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Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect.
Yuanqing Cheng
Aida Todri-Sanial
Jianlei Yang
Weisheng Zhao
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2016)
Keyphrases
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integrated circuit
metal oxide semiconductor
low cost
software systems
electron beam
high speed
real time
artificial intelligence
hardware description language
silicon dioxide
genetic algorithm
three dimensional
process control
semiconductor devices