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Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM).
Meng-Fan Chang
Pi-Feng Chiu
Wei-Cheng Wu
Ching-Hao Chuang
Shyh-Shyuan Sheu
Published in:
ASICON (2011)
Keyphrases
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low power
random access memory
logic circuits
high speed
power consumption
low cost
nm technology
quantum mechanics
delay insensitive
high power
power dissipation
vlsi architecture
single chip
design considerations
wireless transmission
main memory
gate array
digital signal processing
low power consumption
vlsi circuits
signal processor
memory access
artificial intelligence
asynchronous circuits
power saving
digital circuits
mixed signal
high density
optimization algorithm