Challenges and trends in low-power 3D die-stacked IC designs using RAM, memristor logic, and resistive memory (ReRAM).
Meng-Fan ChangPi-Feng ChiuWei-Cheng WuChing-Hao ChuangShyh-Shyuan SheuPublished in: ASICON (2011)
Keyphrases
- low power
- random access memory
- logic circuits
- high speed
- power consumption
- low cost
- nm technology
- quantum mechanics
- delay insensitive
- high power
- power dissipation
- vlsi architecture
- single chip
- design considerations
- wireless transmission
- main memory
- gate array
- digital signal processing
- low power consumption
- vlsi circuits
- signal processor
- memory access
- artificial intelligence
- asynchronous circuits
- power saving
- digital circuits
- mixed signal
- high density
- optimization algorithm